245 FLUX-CORED WIRE

Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. 245 was formerly classified as Type LR per MIL-F-14256. 245 is Bellcore GR-78 compliant.SN62%PB36%AG02 %

 

 

 

 

 

275 FLUX-CORED WIRE

 

Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead bearing and lead-free soldering.SN96.5AG03CU.5

 

 

 

 

 

296 FLUX-CORED WIRE

Kester 296 No-Clean Flux for Cored Solder Wire is halogen-free and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. With its unique flux chemistry system, 296 provides superior workability performance for both manual and automated soldering in the electronics industry, as compared to conventional halogen/halide-based systems. 296 provides good break-off and prevents occurrence of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 296 results in a clear post-soldering residue without need for cleaning. The unique flux system of 296 was also designed to reduce spattering common to most core fluxes. 296 is classified as type ROL0 flux under J-STD-004B specifications.

 

 

 

331 FLUX-CORED WIRE

Kester 331 Organic Flux is a water-soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than rosin fluxes in soldering difficult metals. The same fast action and mild properties are exhibited with 331 Organic Flux as with the liquid 2331-ZX. The flux is more heat stable than most organic fluxes, resulting in minimal smoke and odor. The residue can be completely removed with a simple heated water rinse. Deionized water is suggested to prevent introduction of chemistries from unknown water sources.

 

 

 

 

 

K100LD LEAD-FREE, SILVER-FREE ALLOY BAR SOLDER

 

It is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

 

 

 

 

TIN-LEAD (SNPB) BAR SOLDER

 

Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Ultrapure meets the requirements of IPC/J-STD-006C and will conform to these requirements when purchased directly or through stocking distributors.