Chemtronics BGA Wick Repair Consumables
Chemtronics BGA Wick Repair Consumables
The wick is fabricated from high density copper strands which are precisely cross braided to eliminate oxygen penetration in the pores and therefore ensure fast and safe desoldering. The copper ensures optimum heat transfer via braid to the excess solder to quickly melt and suck it without damaging the circuit board.
Chemtronics BGA Wick Repair Consumables desolders 40% faster than the conventional wick because of its high suction capabilities and eliminates residual flux on pcb. Specifically used in Ball Grid Array (BGA) type of pcb layout and prevents damaged to pads and traces when used properly.
Features
- Sized and Designed specifically for BGA Pads
- Packed in convenient Vacuum – Packs
Salient Features include
- Elimination of residual solder cleaning.
- Elimination of ionic contamination on the boards.
- Packaged in Vacuum – Packs and ESD-safe static dissipative bobbins.
- Minimizes heat damage to the board.
- RoHS compliance.
Specifications
| Product | Size | Colour | 5’ | 10’ | 25’ | 100’ | 500’ | VacupakTM | Application |
| 1.5m | 3.0m | 7.5m | 30.5m | 30.5m | |||||
| Soder-WickR BGA Rosin |
BGA | Purple | 80-BGA-5 | SW180BGA | BGA Pads and Chips | ||||
| Soder-WickR BGA No Clean |
BGA | Purple | 60-BGA-5 | SW160BGA | BGA Pads and Chips |
Why Choose Sumitron ?
