Seal-glo NE series Adhesive for Chip Mounting Machines
Fuji, Japan developed “Seal-glo NE series” adhesives for chip or SMD mounting machines. These are onepart thermo-setting epoxy adhesives with the property of preservation stability, and are of 1 to 2 minute short time or high speed curability required for 120 to 150°C heat-given SMD packaging. Our principals are ready, in addition, to offer the adhesives of various grades with excellent micro printability or with suitability for highspeed dispensers.

Features

• Much lower temperature curing is practically performed.
• Very good stable curing shapes without stringing and slumping at super high speed dispensing and pretty small dots.
• Stable adhesive strength can be obtained with a variety of SMDs.
• Long-term preservation stability is expected.
• High heat-resistivity and excellent electrical property are possessed.

Recommended curing conditions

• The recommended curing condition is; 60 sec. after PCB’s surface temperature has reached 150°C or 90 sec. after the said temperature has come upto 120°C.
• The higher curing temperature and the longer time can obtain the stronger adhesive strength.
• It is suggested that an optimum series of curing conditions should be searched out, for the temperatures exerted on dispensed adhesive may occasionally vary according to the sizes, the lay-out, etc. of component parts to be mounted on PCB’s.

Advantages

• On account of proper viscosity value and thixo ratio for screen printing, no spreading of printing patterns is likely to occur.
• Being a single part adhesive, it has excellent stability against a long period of storage time.
• Having high green strength, no skewing of chips under high speed mounting will take place.

Specifications