Electrolube HTSP Thermal Management System
Electrolube HTSP Thermal Management System
The Silicone Heat Transfer Compound Plus (HTSP) is a silicon oil based, non-curing heat transfer paste, which provides ultimate thermal conductivity for wide temperature range of -50°C to +200°C, while staying electrically insulating.
HTSP – Silicone Heat Transfer Compound Plus
50ml tube – 35ml syringe – 1Kg – 10Kg – 25Kg
This thermal interface material is developed from metal oxides/ceramic powders and designed for applications requiring large amount of heat to be dissipated efficiently, ensuring reliable thermal coupling.
Salient Features
- Superior thermal conductivity even at high temperatures, 3.0 W/m.K.
- Wide operating temperature range from -50°C to +200°C.
- Very low viscosity for ease of application.
- Easy to handle, economic in use and low in toxicity.
- Excellent non-creep characteristics.
- White colour enables treated parts to be easily identified.
- Non-curing paste.
- Allows simple and efficient rework of components if required.
- RoHS-2 Compliant.
- Low evaporation weight loss.
Why Choose Sumitron ?
