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» GAM 70 Laser Vision Measurement
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- Ideal inspection for solder paste thickness, dealing with the increasingly growth of fine pitch, enhanced printing technology and high precision requirement.
- Prevent virous kinds of defect from printing process, such as the bridging, deviation location, etc...
- Laser vision measurement, without contact and damage.
- Statistical charts and process capability index be provided as the real-time data for quality control.
- Easy to operate, fast gather the printing data for reference.
Function
- Measure printed solder thickness, height, length and interval.
- Providing various kind of statistical charts, such as the distributive thickness chart,
.jpg) -R control chart and process capability index: Cp, Cpm ,Cpk for reference.
- Analyze thickness for solder cross-section.
- Inspect lengh and thickness for other kinds of materials.
Application
- Printed solder and copper.
Printing For Control Chart
.jpg)
- -R control chart.
- Cp, Cpk, Cpm capability index.
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Operation And Measurement
- Display image full of screen.
- Easy to sample.
- Easy to operate
- Real-time appearing the statistic.
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Distributive Thickness Chart
- Display and print the distributive thickneess chart.
- Disply and print all the statistic.
- Analysis the percentage for distributive thickness.
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.jpg)
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Specification
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Vision Range (mm)
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4.55×3.5 mm2
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Magnification
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×50 ×90
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Table Size W×L(mm)
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350×265 mm2
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Resolution(mm)
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±0.0035
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Measurement Method
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Laser Vision
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Screen
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15" LCD
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Lens
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Color CCD Lens
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Light
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Circular LED Lighting
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Focus
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Thick / Ting adjustment
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Power
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110V.60Hz / 220V.50Hz
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Dimensions L×W×H(mm)
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350×400×350 mm3
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Weight
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30 kg
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