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Wave/Reflow


Automatic Soldering System
Automatic Soldering System
Reflow System
Reflow System

Automatic Soldering System MDR Series KOICI Koki Tec Corp.

Equipped with nozzles newly designed to meet lead-free solder flowability of "high melting point and low specific gravity". Controls PCDs' separating angles and solder flow speeds at tha "peel-back point".

 

1. Outside adjusting system for “peel-back point” (Option)

The outside adjusting system for "peel-back point" can control the solder flow speed and the angle of detachment of PCBs from the solder surface without stopping solder flow. This system is very effective for bridgeless and fillet-up soldering, enabling stable control of soldering quality even when lead-free solder is used. The attached "setting value check gauge" also realizes reproducibility of the set values.

 

2. Solder Bath Replacement System

Easy replacement with a spare solder bath enables the combined use of lead-free solder and currently-used Sn-Pb eutectic solder.

3. Newly Developed “N2 Tunnel Structure” (Option)

N2 supply system has improved operability and maintainability of the machine by employing a newly developed “nitrogen tunnel structure”, effectively reducing oxide dross of lead-free solder. (The machine can be easily modified from air spec. to N2 spec.)

 

4. Built-in Spray Fluxer is available. (Option)

The coating unit of spray fluxer (VIS-350, able to handle VOC-free) can be built in as an optional extra. Its high coating efficiency can realize even spray coating without soiling the machine.

5. PCB Cooling Unit (Option)

The PCB Cooling Unit can resolve lead-free soldering quality troubles, such as SMT land lifting and shrinkage cavity.



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